IC Technology Development Program Manager Full Time NEW

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission ‘To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Role Overview

This dual-role position is responsible for managing the end-to-end lifecycle of semiconductor product introduction into OSAT test operations, ensuring smooth transfer from NPI to HVM. The manager will lead cross-functional teams, coordinate with customers and internal stakeholders, and drive operational readiness for volume ramp-up in outsourced test factories ( Bangalore).

Key Responsibilities

Program Management Skills:

• Strategic planning: Ability to define program objectives, scope, timelines, and success metrics.
• Stakeholder management: Building trust and alignment across customers, engineering, operations, and suppliers.
• Risk management: Identifying potential issues early, creating mitigation plans, and ensuring contingency readiness.
• Cross-functional leadership: Coordinating diverse teams (design, test, quality, supply chain) to achieve program goals.
• Communication skills: Clear reporting, escalation, and customer-facing updates.
• Change management: Guiding teams through process changes, factory transfers, and technology adoption.

NPI Program Management (Test Focus)

• Program leadership: Own the planning, execution, and delivery of new product introduction test programs.
• Customer interface: Act as the primary point of contact for customers during NPI test phases.
• Test readiness: Ensure test hardware, software, and infrastructure are prepared for product qualification.
• Cross-functional coordination: Work with design, product engineering, quality, and supply chain teams to align test requirements.
• Risk management: Identify and mitigate risks in test program execution.
• Coordinate with factories for Infrastructure readiness and Utilities and Power readiness.

NPI To HVM Factory Transfer Management

• Transfer planning: Develop and execute factory transfer plans from NPI to HVM.
• Process qualification: Oversee qualification of test processes, equipment, and handlers in OSAT factories.
• Ramp readiness: Ensure operational readiness for volume ramp, including yield, cycle time, and cost targets.
• Documentation & compliance: Drive completion of process documentation, control plans, and compliance with customer/industry standards.
• Continuous improvement: Implement lessons learned from NPI into HVM for efficiency and quality improvements.

Essential Attributes

• PMP/Agile certification or equivalent program management training.
• Global OSAT experience with factory transfers across regions.
• Data-driven decision making using yield, test time, and cost metrics.
• Leadership in cross-cultural, cross-functional teams.

Key Success Metrics To Be Measured

• On-time NPI test program delivery.
• Smooth factory transfer with minimal disruption.
• Achievement of HVM yield, quality, and cost targets.
• High customer satisfaction and trust in OSAT capabilities.

Education

• Bachelor’s or Master’s in Electrical/Electronics Engineering, Semiconductor Manufacturing, or related field.

Desired Experience

• 8+ years in semiconductor test operations, program management, or OSAT factory management.
• Technical expertise: Strong knowledge of ATE (Automated Test Equipment), test program development, and semiconductor assembly/test flows
• Project management skills: Proven ability to manage complex, multi-stakeholder projects with tight timelines.
• Communication: Excellent customer-facing and cross-functional communication skills.